We’re excited to announce our poster presentation on
“Large and Heavy Probe Card Exchange and Handling Automation”
at the Advanced Packaging Conference (APC) during SEMICON Europa in Munich.

📅 Date: November 19, 2025
🕣 Time: 8:30 AM – 6:30 PM
📍 Location: ICM Foyer, Room 14a

Our CEO, Andy Nagy, will be presenting and looks forward to engaging discussions about the latest developments in automated probe card handling — a key enabler for safe, ergonomic, and cost efficient semiconductor test operations.

We invite all industry professionals, partners, and technology enthusiasts to stop by, explore our solutions, and exchange ideas!

Let’s shape the future of semiconductor automation together.

👉 We are very much looking forward to your visit at our poster session!